Peak Performance in Compact Devices
Boréas' CapDrive™ technology is revolutionizing thermal management in mobile devices. We've engineered a micropump cooling solution that brings liquid cooling to an unprecedented small form factor. This innovative approach combines our high-efficiency piezo driver with a micropump and PET cooling film, creating a thermal system perfectly suited for smartphones, laptops, and AR/VR headsets where space and heat dissipation are critical.
Unlike traditional cooling methods, Boréas' solution delivers superior thermal performance without compromising device design. Our CapDrive™ architecture ensures ultra-low power consumption while providing precise control for efficient liquid circulation. This enables more powerful processors and sustained performance in compact devices, maintaining a cool user experience. With Boréas' micropump cooling, manufacturers can push device capabilities, backed by a cutting-edge thermal solution.
Thermal management has emerged as the critical bottleneck for device performance, particularly in compact, portable gadgets where space constraints limit cooling options. This challenge is even more pronounced in the foldable phone market, where the area for heat dissipation is halved, and traditional passive cooling solutions fail to accommodate folding mechanisms. As the industry pivots towards on-device AI, the integration of neural processing units (NPUs) in system-on-chip designs is set to generate unprecedented heat levels.
The advent of NPUs in mobile devices marks a pivotal moment in smartphone evolution, promising enhanced AI capabilities but also demanding innovative thermal solutions. This shift necessitates a reimagining of heat management strategies, pushing manufacturers to develop cutting-edge cooling technologies that maintain optimal performance without compromising sleek form factors. As the mobile industry races to harness on-device AI, effective heat management will undoubtedly become a key differentiator in the next generation of smartphones.
Bendable
Our cooling solution utilizes PET film that exhibits exceptional flexibility, capable of withstanding over 200,000 bending cycles without degradation in performance. This remarkable bendability makes it ideal for integration into cutting-edge foldable devices such as smartphones and laptops.
Thin
The PET film used in our cooling solution can achieve an incredibly slim profile, with thicknesses as low as 0.3 mm. This ultra-thin design allows for seamless integration into compact electronic devices without compromising their sleek form factor.
Low power consumption
This application is only possible thanks to our CapDrive technology (with 10x power savings). Other piezo drivers generate more heat than what the actual system can save.
Recommended Part
For piezo micropump applications, we recommend the Boréas Technologies BOS1931. This single-chip driver delivers high-voltage, low-power performance with advanced features like energy recovery, differential output, and waveform synthesis. Compact and efficient, the BOS1931 supports capacitive loads up to 820 nF and operates within a 3–5.5 V supply range. Its fast startup time and multi-actuator synchronization make it ideal for precise, responsive systems, including haptic feedback, microfluidics, and compact actuation solutions.
